IBM has long favored using the name “notebook” rather than “laptop” because many notebook devices run too hot to actually use in one’s lap. As laptops, such as my workstation-class ThinkPad, with discrete graphics and fast processors have become more powerful, the challenge of providing adequate cooling has been meet in a variety of ways. The trend so far has been toward larger, faster fans and extensive internal ducting, but that trend is nearing the limits of what users will find acceptable.
Compounding the problem of fan-cooling limitations is the increasing trend toward thinner, lighter notebooks. In these ultra-slim devices, the motherboard (aka system board) by necessity has to be mounted close to the external skin. This means that some of the heat generated by the processor, supporting chips, and graphics adapters is dispersed by heating the inside layer of the skin rather than being expelled out the ducting.
Intel’s Mooly Eden thinks he has a better idea, and he demonstrated Intel’s laminar airflow laptop modification on October 21, 2008 at the Intel Developer Forum in Taipei, Republic of China. His address was called “Expanding the Frontiers of Mobility.”
All Images: Intel